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 MCP4802/4812/4822
8/10/12-Bit Dual Voltage Output Digital-to-Analog Converter with Internal VREF and SPI Interface
Features
* * * * * * * * * * * * MCP4802: Dual 8-Bit Voltage Output DAC MCP4812: Dual 10-Bit Voltage Output DAC MCP4822: Dual 12-Bit Voltage Output DAC Rail-to-Rail Output SPI Interface with 20 MHz Clock Support Simultaneous Latching of the Dual DACs with LDAC pin Fast Settling Time of 4.5 s Selectable Unity or 2x Gain Output 2.048V Internal Voltage Reference 50 ppm/C VREF Temperature Coefficient 2.7V to 5.5V Single-Supply Operation Extended Temperature Range: -40C to +125C
Description
The MCP4802/4812/4822 devices are dual 8-bit, 10-bit and 12-bit buffered voltage output Digital-to-Analog Converters (DACs), respectively. The devices operate from a single 2.7V to 5.5V supply with SPI compatible Serial Peripheral Interface. The devices have a high precision internal voltage reference (VREF = 2.048V). The user can configure the full-scale range of the device to be 2.048V or 4.096V by setting the Gain Selection Option bit (gain of 1 of 2). Each DAC channel can be operated in Active or Shutdown mode individually by setting the Configuration register bits. In Shutdown mode, most of the internal circuits in the shutdown channel are turned off for power savings and the output amplifier is configured to present a known high resistance output load (500 k typical. The devices include double-buffered registers, allowing synchronous updates of two DAC outputs using the LDAC pin. These devices also incorporate a Power-on Reset (POR) circuit to ensure reliable powerup. The devices utilize a resistive string architecture, with its inherent advantages of low DNL error, low ratio metric temperature coefficient and fast settling time. These devices are specified over the extended temperature range (+125C). The devices provide high accuracy and low noise performance for consumer and industrial applications where calibration or compensation of signals (such as temperature, pressure and humidity) are required. The MCP4802/4812/4822 devices are available in the PDIP, SOIC and MSOP packages.
Applications
* * * * * Set Point or Offset Trimming Sensor Calibration Precision Selectable Voltage Reference Portable Instrumentation (Battery-Powered) Calibration of Optical Communication Devices
Related Products(1)
P/N MCP4801 MCP4811 MCP4821 MCP4802 MCP4812 MCP4822 MCP4901 MCP4911 MCP4921 MCP4902 MCP4912 MCP4922 DAC Resolution 8 10 12 8 10 12 8 10 12 8 10 12 No. of Channels 1 1 1 2 2 2 1 1 1 2 2 2 External Internal (2.048V) Voltage Reference (VREF)
Package Types
8-Pin PDIP, SOIC, MSOP MCP48X2
VDD 1 CS 2 SCK 3 SDI 4 8 VOUTA 7 VSS 6 VOUTB 5 LDAC
MCP4802: 8-bit dual DAC MCP4812: 10-bit dual DAC MCP4822: 12-bit dual DAC
Note 1: The products listed here have similar AC/DC performances.
2010 Microchip Technology Inc.
DS22249A-page 1
MCP4802/4812/4822
Block Diagram
CS SDI SCK LDAC VDD VSS Input Input Register A Register B DACA Register DACB Register 2.048V VREF
Interface Logic
Power-on Reset
String DACA Gain Logic
String DACB
Output Op Amps Output Logic
Gain Logic
VOUTA
VOUTB
DS22249A-page 2
2010 Microchip Technology Inc.
MCP4802/4812/4822
1.0 ELECTRICAL CHARACTERISTICS
Notice: Stresses above those listed under "Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.
Absolute Maximum Ratings
VDD....................................................................... 6.5V All inputs and outputs .......... VSS - 0.3V to VDD + 0.3V Current at Input Pins ......................................... 2 mA Current at Supply Pins .................................... 50 mA Current at Output Pins .................................... 25 mA Storage temperature .......................... -65C to +150C Ambient temp. with power applied ..... -55C to +125C ESD protection on all pins 4 kV (HBM), 400V (MM) Maximum Junction Temperature (TJ)................+150C
ELECTRICAL CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, VDD = 5V, VSS = 0V, VREF = 2.048V, Output Buffer Gain (G) = 2x, RL = 5 k to GND, CL = 100 pF, TA = -40 to +85C. Typical values are at +25C.
Parameters Power Requirements Input Voltage Input Current
Sym VDD IDD
Min 2.7 --
Typ -- 415
Max 5.5 750
Units V A
Conditions
All digital inputs are grounded, all analog outputs (VOUT) are unloaded. Code = 0x000h
Software Shutdown Current Power-on Reset Threshold DC Accuracy MCP4802 Resolution INL Error DNL MCP4812 Resolution INL Error DNL MCP4822 Resolution INL Error DNL Offset Error Offset Error Temperature Coefficient Gain Error Gain Error Temperature Coefficient Note 1: 2:
ISHDN_SW VPOR
-- --
3.3 2.0
6 --
A V
n INL DNL n INL DNL n INL DNL VOS VOS/C gE G/C
8 -1 -0.5 10 -3.5 -0.5 12 -12 -0.75 -1 -- -- -2 --
-- 0.125 0.1 -- 0.5 0.1 -- 2 0.2 0.02 0.16 -0.44 -0.10 -3
-- 1 +0.5 -- 3.5 +0.5 -- 12 +0.75 1 -- -- 2 --
Bits LSb LSb Bits LSb LSb Bits LSb LSb ppm/C ppm/C Note 1 -45C to +25C +25C to +85C % of FSR Code = 0x000h Note 1 Note 1
% of FSR Code = 0xFFFh, not including offset error ppm/C
Guaranteed monotonic by design over all codes. This parameter is ensured by design, and not 100% tested.
2010 Microchip Technology Inc.
DS22249A-page 3
MCP4802/4812/4822
ELECTRICAL CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise indicated, VDD = 5V, VSS = 0V, VREF = 2.048V, Output Buffer Gain (G) = 2x, RL = 5 k to GND, CL = 100 pF, TA = -40 to +85C. Typical values are at +25C.
Parameters Internal Reference Voltage Temperature Coefficient (Note 2)
Sym VREF VREF/C
Min 2.008 -- -- -- --
Typ 2.048 125 0.25 45 0.09 290
Max 2.088 325 0.65 160 0.32 --
Units V ppm/C LSb/C ppm/C LSb/C Vp-p
Conditions VOUTA when G = 1x and Code = 0xFFFh -40C to 0C -40C to 0C 0C to +85C 0C to +85C Code = 0xFFFh, G = 1x
Internal Voltage Reference (VREF)
Output Noise (VREF Noise)
ENREF (0.110 Hz) eNREF (1 kHz) eNREF (10 kHz)
--
Output Noise Density
-- -- -- -- -- -- -- --
1.2 1.0 400 0.01 to VDD - 0.04 66 0.55 15 4.5
-- -- -- -- -- -- 24 --
V/Hz V/Hz Hz V Degree () V/s mA s
Code = 0xFFFh, G = 1x Code = 0xFFFh, G = 1x
1/f Corner Frequency Output Amplifier Output Swing Phase Margin Slew Rate Short Circuit Current Settling Time
fCORNER VOUT PM SR ISC tSETTLING
Accuracy is better than 1 LSb for VOUT = 10 mV to (VDD-40 mV) CL= 400 pF, RL =
Within 1/2 LSb of final value from 1/4 to 3/4 full-scale range
Dynamic Performance (Note 2) DAC-to-DAC Crosstalk Major Code Transition Glitch -- -- <10 45 -- -- nV-s nV-s 1 LSb change around major carry (0111...1111 to 1000...0000)
Digital Feedthrough Analog Crosstalk Note 1: 2:
-- --
<10 <10
-- --
nV-s nV-s
Guaranteed monotonic by design over all codes. This parameter is ensured by design, and not 100% tested.
DS22249A-page 4
2010 Microchip Technology Inc.
MCP4802/4812/4822
ELECTRICAL CHARACTERISTIC WITH EXTENDED TEMPERATURE
Electrical Specifications: Unless otherwise indicated, VDD = 5V, VSS = 0V, VREF = 2.048V, Output Buffer Gain (G) = 2x, RL = 5 k to GND, CL = 100 pF. Typical values are at +125C by characterization or simulation.
Parameters Power Requirements Input Voltage Input Current Input Curren Software Shutdown Current Power-On Reset threshold DC Accuracy MCP4802 Resolution INL Error DNL MCP4812 Resolution INL Error DNL MCP4822 Resolution INL Error DNL Offset Error Offset Error Temperature Coefficient Gain Error Gain Error Temperature Coefficient Internal Reference Voltage Temperature Coefficient (Note 2)
Sym VDD IDD
Min 2.7 --
Typ -- 440
Max 5.5 --
Units V A
Conditions
All digital inputs are grounded, all analog outputs (VOUT) are unloaded. Code = 0x000h.
ISHDN_SW VPOR
-- --
5 1.85
-- --
A V
n INL DNL n INL DNL n INL DNL VOS VOS/C gE G/C
8 -- -- 10 -- -- 12 -- -- -- -- -- --
-- 0.25 0.2 -- 1 0.2 -- 4 0.25 0.02 -5 -0.10 -3
-- -- -- -- -- -- -- -- -- -- -- -- --
Bits LSb LSb Bits LSb LSb Bits LSb LSb % of FSR ppm/C % of FSR ppm/C Note 1 Code = 0x000h +25C to +125C Code = 0xFFFh, not including offset error Note 1 Note 1
Internal Voltage Reference (VREF) VREF VREF/C -- -- -- -- -- Output Noise (VREF Noise) Output Noise Density ENREF (0.1 - 10 Hz) eNREF (1 kHz) eNREF (10 kHz) 1/f Corner Frequency Note 1: 2: fCORNER -- -- -- -- 2.048 125 0.25 45 0.09 290 1.2 1.0 400 -- -- -- -- -- -- -- -- -- V ppm/C LSb/C ppm/C LSb/C Vp-p V/Hz V/Hz Hz VOUTA when G = 1x and Code = 0xFFFh -40C to 0C -40C to 0C 0C to +85C 0C to +85C Code = 0xFFFh, G = 1x Code = 0xFFFh, G = 1x Code = 0xFFFh, G = 1x
Guaranteed monotonic by design over all codes. This parameter is ensured by design, and not 100% tested.
2010 Microchip Technology Inc.
DS22249A-page 5
MCP4802/4812/4822
ELECTRICAL CHARACTERISTIC WITH EXTENDED TEMPERATURE (CONTINUED)
Electrical Specifications: Unless otherwise indicated, VDD = 5V, VSS = 0V, VREF = 2.048V, Output Buffer Gain (G) = 2x, RL = 5 k to GND, CL = 100 pF. Typical values are at +125C by characterization or simulation.
Parameters Output Amplifier Output Swing
Sym VOUT
Min --
Typ 0.01 to VDD - 0.04
Max --
Units V
Conditions Accuracy is better than 1 LSb for VOUT = 10 mV to (VDD - 40 mV)
Phase Margin Slew Rate Short Circuit Current Settling Time
PM SR ISC tSETTLING
-- -- -- --
66 0.55 17 4.5
-- -- -- --
Degree () CL= 400 pF, RL = V/s mA s Within 1/2 LSb of final value from 1/4 to 3/4 full-scale range
Dynamic Performance (Note 2) DAC-to-DAC Crosstalk Major Code Transition Glitch Digital Feedthrough Analog Crosstalk Note 1: 2: -- -- <10 45 -- -- nV-s nV-s 1 LSb change around major carry (0111...1111 to 1000...0000)
-- --
<10 <10
-- --
nV-s nV-s
Guaranteed monotonic by design over all codes. This parameter is ensured by design, and not 100% tested.
AC CHARACTERISTICS (SPI TIMING SPECIFICATIONS)
Electrical Specifications: Unless otherwise indicated, VDD= 2.7V - 5.5V, TA= -40 to +125C. Typical values are at +25C. Parameters Schmitt Trigger High-Level Input Voltage (All digital input pins) Schmitt Trigger Low-Level Input Voltage (All digital input pins) Hysteresis of Schmitt Trigger Inputs Input Leakage Current Digital Pin Capacitance (All inputs/outputs) Clock Frequency Clock High Time Clock Low Time CS Fall to First Rising CLK Edge Data Input Setup Time Data Input Hold Time SCK Rise to CS Rise Hold Time
Note 1:
Sym VIH
Min 0.7 VDD
Typ --
Max --
Units V
Conditions
VIL
--
--
0.2 VDD
V
VHYS ILEAKAGE CIN, COUT FCLK tHI tLO tCSSR tSU tHD tCHS
-- -1 -- -- 15 15 40 15 10 15
0.05 VDD -- 10 -- -- -- -- -- -- --
-- 1 -- 20 -- -- -- -- -- --
V A pF MHz ns ns ns ns ns ns LDAC = CS = SDI = SCK = VDD or VSS VDD = 5.0V, TA = +25C, fCLK = 1 MHz (Note 1) TA = +25C (Note 1) Note 1 Note 1 Applies only when CS falls with CLK high. (Note 1) Note 1 Note 1 Note 1
This parameter is ensured by design and not 100% tested.
DS22249A-page 6
2010 Microchip Technology Inc.
MCP4802/4812/4822
AC CHARACTERISTICS (SPI TIMING SPECIFICATIONS)
Electrical Specifications: Unless otherwise indicated, VDD= 2.7V - 5.5V, TA= -40 to +125C. Typical values are at +25C. Parameters CS High Time LDAC Pulse Width LDAC Setup Time SCK Idle Time before CS Fall
Note 1:
Sym tCSH tLD tLS tIDLE
Min 15 100 40 40
Typ -- -- -- --
Max -- -- -- --
Units ns ns ns ns Note 1 Note 1 Note 1 Note 1
Conditions
This parameter is ensured by design and not 100% tested.
tCSH CS tCSSR Mode 1,1 SCK Mode 0,0 SDI tSU tHD LSb in tHI tLO tIDLE tCHS
MSb in
LDAC tLS tLD
FIGURE 1-1:
SPI Input Timing Data.
TEMPERATURE CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, VDD = +2.7V to +5.5V, VSS = GND. Parameters Temperature Ranges Specified Temperature Range Operating Temperature Range Storage Temperature Range Thermal Package Resistances Thermal Resistance, 8L-MSOP Thermal Resistance, 8L-PDIP Thermal Resistance, 8L-SOIC Note 1: JA JA JA -- -- -- 211 90 150 -- -- -- C/W C/W C/W TA TA TA -40 -40 -65 -- -- -- +125 +125 +150 C C C Note 1 Sym Min Typ Max Units Conditions
The MCP4802/4812/4822 devices operate over this extended temperature range, but with reduced performance. Operation in this range must not cause TJ to exceed the maximum junction temperature of +150C.
2010 Microchip Technology Inc.
DS22249A-page 7
MCP4802/4812/4822
NOTES:
DS22249A-page 8
2010 Microchip Technology Inc.
MCP4802/4812/4822
2.0
Note:
TYPICAL PERFORMANCE CURVES
The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Note: Unless otherwise indicated, TA = +25C, VDD = 5V, VSS = 0V, VREF = 2.048V, Gain = 2x, RL = 5 k, CL = 100 pF.
0.3 0.2 DNL (LSB) 5 4 3 2 1 0 -1 -2 -3 -4 -5 0 1024 2048
Ambient Temperature
125C
85
25
0 -0.1 -0.2 -0.3 0 1024 2048 Code (Decimal) 3072 4096
INL (LSB)
0.1
3072
4096
Code (Decimal)
FIGURE 2-1:
DNL vs. Code (MCP4822).
FIGURE 2-4: INL vs. Code and Temperature (MCP4822).
2.5 Absolute INL (LSB) 2 1.5 1 0.5 0
0.2 0.1 DNL (LSB) 0 -0.1 -0.2 0 1024 2048 3072
125C 85C
4096
25C
-40
-20
0
20
40
60
80
100
120
Code (Decimal)
Ambient Temperature (C)
FIGURE 2-2: DNL vs. Code and Temperature (MCP4822).
0.0766 Absolute DNL (LSB) 0.0764 0.0762 0.0758 0.0756 0.0754 0.0752 0.075 -40 -20 0 20 40 60 80 100 120 Ambient Temperature (C)
FIGURE 2-5: Absolute INL vs. Temperature (MCP4822).
2 0 INL (LSB) -2 -4 -6 0 1024 2048 Code (Decimal) 3072 4096
0.076
FIGURE 2-3: Absolute DNL vs. Temperature (MCP4822).
FIGURE 2-6:
Note:
INL vs. Code (MCP4822).
Single device graph for illustration of 64 code effect.
2010 Microchip Technology Inc.
DS22249A-page 9
MCP4802/4812/4822
Note: Unless otherwise indicated, TA = +25C, VDD = 5V, VSS = 0V, VREF = 2.048V, Gain = 2x, RL = 5 k, CL = 100 pF.
0.3
- 40 C
o
0.6 0.5 0.4 INL (LSB) 0.3 0.2 0.1 0 -0.1
125oC
- 40oC 85 C
o
0.2
DNL (LSB)
0.1 0 -0.1 -0.2 -0.3 0 128 256 384
+25oC to +125oC
-0.2 -0.3
896 1024
25oC
Code
512
640
768
0
32
64
96
128 Code
160
192
224
256
FIGURE 2-7: DNL vs. Code and Temperature (MCP4812).
FIGURE 2-10: INL vs. Code and Temperature (MCP4802).
2.050 2.049 2.048 2.047 2.046 2.045 2.044 2.043 2.042 2.041 2.040 -40 -20 0 20 40 60
1.5 1 0.5
85oC
INL (LSB)
0 -0.5 -1 -1.5 -2 -2.5 -3 0 128 256 384
125 C
o
Full Scale VOUT (V)
VDD: 4V VDD: 3V VDD: 2.7V
25oC - 40 C
o
80
100 120
Code
512
640
768
896 1024
Ambient Temperature (C)
FIGURE 2-8: INL vs. Code and Temperature (MCP4812).
0.15 0.1 DNL (LSB) 0.05 0
34
FIGURE 2-11: Full-Scale VOUTA vs. Ambient Temperature and VDD. Gain = 1x.
Temperature: - 40 C to +125 C
o
o
4.100 Full Scale VOUT (V) 4.096 4.092 4.088 4.084 4.080 4.076
VDD: 5.5V VDD: 5V
-0.05 -0.1 -0.15 0 32 64 96 128 160 192 224 256 Code
-40
-20
0
20
40
60
80
100 120
Ambient Temperature (C)
FIGURE 2-9: DNL vs. Code and Temperature (MCP4802).
FIGURE 2-12: Full-Scale VOUTA vs. Ambient Temperature and VDD. Gain = 2x.
DS22249A-page 10
2010 Microchip Technology Inc.
MCP4802/4812/4822
Note: Unless otherwise indicated, TA = +25C, VDD = 5V, VSS = 0V, VREF = 2.048V, Gain = 2x, RL = 5 k, CL = 100 pF.
Output Noise Voltage Density (V/Hz) 100 1.E-04
25 20 Occurrence 15 10 5 0 380 385 390 395 400 405 410 415 420 425 430 430 435 435
1.E-05 10
1 1.E-06
0.1 1.E-07 0.1 1E-1
1 1E+0
10 1E+1
100 1E+2
1k 1E+3
10k 1E+4
100k 1E+5
Frequency (Hz)
IDD (A)
FIGURE 2-13: Output Noise Voltage Density (VREF Noise Density) vs. Frequency. Gain = 1x.
1.E-02 10.0 Output Noise Voltage (mV)
FIGURE 2-16:
IDD Histogram (VDD = 2.7V).
1.E-03 1.00
Eni (in VP-P)
0.10 1.E-04
Eni (in VRMS) Maximum Measurement Time = 10s
0.01 1.E-05 100 1E+2
22 20 18 16 14 12 10 8 6 4 2 0 385 390 395 400 405 410 415 420 IDD (A) 425
1k 1E+3
10k 100k 1E+4 1E+5 Bandwidth (Hz)
1M 1E+6
FIGURE 2-14: Output Noise Voltage (VREF Noise Voltage) vs. Bandwidth. Gain = 1x.
340 320 300
5.5V 5.0V 4.0V 3.0V 2.7V VDD
FIGURE 2-17:
Occurrence
IDD Histogram (VDD = 5.0V).
IDD (A)
280 260 240 220 200 180 -40 -20 0 20 40 60 80 100 120
Ambient Temperature (C)
FIGURE 2-15:
IDD vs. Temperature and VDD.
2010 Microchip Technology Inc.
DS22249A-page 11
440
MCP4802/4812/4822
Note: Unless otherwise indicated, TA = +25C, VDD = 5V, VSS = 0V, VREF = 2.048V, Gain = 2x, RL = 5 k, CL = 100 pF.
4 3.5 4 3.5
VDD 5.5V 5.0V
5.5V 5.0V
ISHDN_SW (A)
3 2.5
VIN Hi Threshold (V)
4.0V
3 2.5 2
3.0V 4.0V
3.0V
2 1.5 1 -40 -20 0 20 40 60 80 100 120
2.7V V DD
1.5 1 -40 -20 0 20 40 60 80 100 120
2.7V
Ambient Temperature (C)
Ambient Temperature (C)
FIGURE 2-18: Software Shutdown Current vs. Temperature and VDD.
0.11
FIGURE 2-21: VIN High Threshold vs. Temperature and VDD.
1.6
VDD 5.5V 5.0V
0.09 Offset Error (%) 0.07 0.05 0.03 0.01 -0.01 -0.03 -40 -20 0 20 40 60 80 100 120 Ambient Temperature (C)
5.0V 4.0V 3.0V 2.7V 5.5V VDD
VIN Low Threshold (V)
1.5 1.4 1.3 1.2 1.1 1 0.9 0.8 -40 -20 0 20 40 60 80 100 120
4.0V
3.0V 2.7V
Ambient Temperature (C)
FIGURE 2-19: and VDD.
-0.05 -0.1 -0.15
Offset Error vs. Temperature
FIGURE 2-22: VIN Low Threshold vs. Temperature and VDD.
VDD 5.5V 5.0V 4.0V 3.0V 2.7V
Gain Error (%)
-0.2 -0.25 -0.3 -0.35 -0.4 -0.45 -0.5 -40 -20 0 20 40 60 80 100 120
Ambient Temperature (C)
FIGURE 2-20: and VDD.
Gain Error vs. Temperature
DS22249A-page 12
2010 Microchip Technology Inc.
MCP4802/4812/4822
Note: Unless otherwise indicated, TA = +25C, VDD = 5V, VSS = 0V, VREF = 2.048V, Gain = 2x, RL = 5 k, CL = 100 pF.
2.5 2.25 16 15
VDD 5.5V 5.0V 4.0V 3.0V 2.7V
VIN_SPI Hysteresis (V)
1.75 1.5 1.25 1 0.75 0.5 0.25 0 -40 -20 0 20 40 60 80 100 120
IOUT_HI_SHORTED (mA)
2
14 13 12 11 10 -40 -20 0 20 40 60 80 100 120
5.5V 5.0V 4.0V 3.0V 2.7V VDD
Ambient Temperature (C)
Ambient Temperature (C)
FIGURE 2-23: Input Hysteresis vs. Temperature and VDD.
0.035 0.033
FIGURE 2-26: IOUT High Short vs. Temperature and VDD.
6.0 5.0 VOUT (V) 4.0 3.0 2.0 1.0 0.0
Output Shorted to VSS VREF = 4.096V Output Shorted to VDD
4.0V
VOUT_HI Limit (VDD-Y)(V)
0.031 0.029 0.027 0.025 0.023 0.021 0.019 0.017 0.015 -40 -20 0 20 40 60 80 100 120
3.0V 2.7V VDD
0
2
4
Ambient Temperature (C)
6 8 10 IOUT (mA)
12
14
16
FIGURE 2-24: VOUT High Limit vs.Temperature and VDD.
0.0028
VDD 5.5V 5.0V 4.0V 3.0V 2.7V
FIGURE 2-27:
IOUT vs. VOUT. Gain = 2x.
VOUT_LOW Limit (Y-AVSS)(V)
0.0026 0.0024 0.0022 0.0020 0.0018 0.0016 0.0014 0.0012 0.0010 -40 -20 0 20 40 60 80 100 120
Ambient Temperature (C)
FIGURE 2-25: VOUT Low Limit vs. Temperature and VDD.
2010 Microchip Technology Inc.
DS22249A-page 13
MCP4802/4812/4822
Note: Unless otherwise indicated, TA = +25C, VDD = 5V, VSS = 0V, VREF = 2.048V, Gain = 2x, RL = 5 k, CL = 100 pF.
VOUT VOUT SCK LDAC Time (1 s/div) LDAC Time (1 s/div)
FIGURE 2-28:
VOUT Rise Time.
FIGURE 2-31:
VOUT Rise Time.
VOUT VOUT SCK SCK LDAC Time (1 s/div) LDAC Time (1 s/div)
FIGURE 2-29:
VOUT Fall Time.
FIGURE 2-32: Shutdown.
VOUT Rise Time Exit
VOUT SCK
LDAC Time (1 s/div)
Ripple Rejection (dB)
Frequency (Hz)
FIGURE 2-30:
VOUT Rise Time.
FIGURE 2-33:
PSRR vs. Frequency.
DS22249A-page 14
2010 Microchip Technology Inc.
MCP4802/4812/4822
3.0 PIN DESCRIPTIONS
PIN FUNCTION TABLE FOR MCP4802/4812/4822
Symbol VDD CS SCK SDI LDAC VOUTB VSS VOUTA Description Supply Voltage Input (2.7V to 5.5V) Chip Select Input Serial Clock Input Serial Data Input Synchronization Input. This pin is used to transfer DAC settings (Input Registers) to the output registers (VOUT) DACB Output Ground reference point for all circuitry on the device DACA Output The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
MCP4802/4812/4822 MSOP, PDIP, SOIC 1 2 3 4 5 6 7 8
3.1
Supply Voltage Pins (VDD, VSS)
3.4
Serial Data Input (SDI)
VDD is the positive supply voltage input pin. The input supply voltage is relative to VSS and can range from 2.7V to 5.5V. The power supply at the VDD pin should be as clean as possible for a good DAC performance. It is recommended to use an appropriate bypass capacitor of about 0.1 F (ceramic) to ground. An additional 10 F capacitor (tantalum) in parallel is also recommended to further attenuate high-frequency noise present in application boards. VSS is the analog ground pin and the current return path of the device. The user must connect the VSS pin to a ground plane through a low-impedance connection. If an analog ground path is available in the application Printed Circuit Board (PCB), it is highly recommended that the VSS pin be tied to the analog ground path or isolated within an analog ground plane of the circuit board.
SDI is the SPI compatible serial data input pin.
3.5
Latch DAC Input (LDAC)
LDAC (latch DAC synchronization input) pin is used to transfer the input latch registers to their corresponding DAC registers (output latches, VOUT). When this pin is low, both VOUTA and VOUTB are updated at the same time with their input register contents. This pin can be tied to low (VSS) if the VOUT update is desired at the rising edge of the CS pin. This pin can be driven by an external control device such as an MCU I/O pin.
3.6
Analog Outputs (VOUTA, VOUTB)
3.2
Chip Select (CS)
CS is the Chip Select input pin, which requires an active-low to enable serial clock and data functions.
VOUTA is the DAC A output pin, and VOUTB is the DAC B output pin. Each output has its own output amplifier. The full-scale range of the DAC output is from VSS to G* VREF, where G is the gain selection option (1x or 2x). The DAC analog output cannot go higher than the supply voltage (VDD).
3.3
Serial Clock Input (SCK)
SCK is the SPI compatible serial clock input pin.
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MCP4802/4812/4822
4.0 GENERAL OVERVIEW
The MCP4802, MCP4812 and MCP4822 are dual voltage output 8-bit, 10-bit and 12-bit DAC devices, respectively. These devices include rail-to-rail output amplifiers, internal voltage reference, shutdown and reset-management circuitry. The devices use an SPI serial communication interface and operate with a single supply voltage from 2.7V to 5.5V. The DAC input coding of these devices is straight binary. Equation 4-1 shows the DAC analog output voltage calculation. 1 LSb is the ideal voltage difference between two successive codes. Table 4-1 illustrates the LSb calculation of each device.
TABLE 4-1:
Device MCP4802 (n = 8) MCP4812 (n = 10) MCP4822 (n = 12)
LSb OF EACH DEVICE
Gain Selection 1x 2x 1x 2x 1x 2x LSb Size 2.048V/256 = 8 mV 4.096V/256 = 16 mV 2.048V/1024 = 2 mV 4.096V/1024 = 4 mV 2.048V/4096 = 0.5 mV 4.096V/4096 = 1 mV
EQUATION 4-1:
ANALOG OUTPUT VOLTAGE (VOUT)
2.048V Dn = ---------------------------------- G n 2
4.0.1
INL ACCURACY
V OUT Where: 2.048V Dn G = = = = = n = = = =
Internal voltage reference DAC input code Gain selection 2 for bit = 0 1 for bit = 1 DAC Resolution 8 for MCP4802 10 for MCP4812 12 for MCP4822
Integral Non-Linearity (INL) error for these devices is the maximum deviation between an actual code transition point and its corresponding ideal transition point once offset and gain errors have been removed. The two end points method (from 0x000 to 0xFFF) is used for the calculation. Figure 4-1 shows the details. A positive INL error represents transition(s) later than ideal. A negative INL error represents transition(s) earlier than ideal.
INL < 0 111 110 101 Digital Input Code 100 011 010 001 000 INL < 0 DAC Output Ideal Transfer Function Actual Transfer Function
The ideal output range of each device is: * MCP4802 (n = 8) (a) 0.0V to 255/256 * 2.048V when gain setting = 1x. (b) 0.0V to 255/256 * 4.096V when gain setting = 2x. * MCP4812 (n = 10) (a) 0.0V to 1023/1024 * 2.048V when gain setting = 1x. (b) 0.0V to 1023/1024 * 4.096V when gain setting = 2x. * MCP4822 (n = 12) (a) 0.0V to 4095/4096 * 2.048V when gain setting = 1x. (b) 0.0V to 4095/4096 * 4.096V when gain setting = 2x. Note: See the output swing voltage specification in Section 1.0 "Electrical Characteristics".
FIGURE 4-1:
Example for INL Error.
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MCP4802/4812/4822
4.0.2 DNL ACCURACY
4.1
4.1.1
Circuit Descriptions
OUTPUT AMPLIFIERS
A Differential Non-Linearity (DNL) error is the measure of variations in code widths from the ideal code width. A DNL error of zero indicates that every code is exactly 1 LSb wide.
111 110 101 Digital Input Code 100 011 010 001 000
Actual Transfer Function
The DAC's outputs are buffered with a low-power, precision CMOS amplifier. This amplifier provides low offset voltage and low noise. The output stage enables the device to operate with output voltages close to the power supply rails. Refer to Section 1.0 "Electrical Characteristics" for the analog output voltage range and load conditions. In addition to resistive load-driving capability, the amplifier will also drive high capacitive loads without oscillation. The amplifier's strong outputs allow VOUT to be used as a programmable voltage reference in a system.
Ideal Transfer Function
4.1.1.1
Wide Code, >1 LSb Narrow Code, <1 LSb DAC Output
Programmable Gain Block
The rail-to-rail output amplifier has two configurable gain options: a gain of 1x ( = 1) or a gain of 2x ( = 0). The default value for this bit is a gain of 2 ( = 0). This results in an ideal full-scale output of 0.000V to 4.096V due to the internal reference (VREF = 2.048V).
FIGURE 4-2: 4.0.3
Example for DNL Error.
4.1.2
VOLTAGE REFERENCE
OFFSET ERROR
An offset error is the deviation from zero voltage output when the digital input code is zero.
The MCP4802/4812/4822 devices utilize internal 2.048V voltage reference. The voltage reference has a low temperature coefficient and low noise characteristics. Refer to Section 1.0 "Electrical Characteristics" for the voltage reference specifications.
4.0.4
GAIN ERROR
A gain error is the deviation from the ideal output, VREF - 1 LSb, excluding the effects of offset error.
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MCP4802/4812/4822
4.1.3 POWER-ON RESET CIRCUIT 4.1.4 SHUTDOWN MODE
The internal Power-on Reset (POR) circuit monitors the power supply voltage (VDD) during the device operation. The circuit also ensures that the DAC powers up with high output impedance ( = 0, typically 500 k. The devices will continue to have a high-impedance output until a valid write command is received and the LDAC pin meets the input low threshold. If the power supply voltage is less than the POR threshold (VPOR = 2.0V, typical), the DACs will be held in their Reset state. The DACs will remain in that state until VDD > VPOR and a subsequent write command is received. Figure 4-3 shows a typical power supply transient pulse and the duration required to cause a reset to occur, as well as the relationship between the duration and trip voltage. A 0.1 F decoupling capacitor, mounted as close as possible to the VDD pin, can provide additional transient immunity. The user can shut down each DAC channel selectively using a software command ( = 0). During Shutdown mode, most of the internal circuits in the channel that was shut down are turned off for power savings. The internal reference is not affected by the shutdown command. The serial interface also remains active, thus allowing a write command to bring the device out of the Shutdown mode. There will be no analog output at the channel that was shut down and the VOUT pin is internally switched to a known resistive load (500 k typical. Figure 4-4 shows the analog output stage during the Shutdown mode. The device will remain in Shutdown mode until the bit = 1 is latched into the device. When a DAC channel is changed from Shutdown to Active mode, the output settling time takes < 10 s, but greater than the standard active mode settling time (4.5 s).
VOUT
Op Amp
Supply Voltages
5V VPOR VDD - VPOR Transient Duration
Resistive String DAC Power-Down Control Circuit Resistive Load
500 k
Time Transient Duration (s) 10 8 6 4 2 0 1
Transients above the curve will cause a reset Transients below the curve will NOT cause a reset
TA = +25C
FIGURE 4-4: Mode.
Output Stage for Shutdown
2 3 4 VDD - VPOR (V)
5
FIGURE 4-3:
Typical Transient Response.
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MCP4802/4812/4822
5.0
5.1
SERIAL INTERFACE
Overview
5.2
Write Command
The MCP4802/4812/4822 devices are designed to interface directly with the Serial Peripheral Interface (SPI) port, available on many microcontrollers, and supports Mode 0,0 and Mode 1,1. Commands and data are sent to the device via the SDI pin, with data being clocked-in on the rising edge of SCK. The communications are unidirectional and, thus, data cannot be read out of the MCP4802/4812/4822 devices. The CS pin must be held low for the duration of a write command. The write command consists of 16 bits and is used to configure the DAC's control and data latches. Register 5-1 to Register 5-3 detail the input register that is used to configure and load the DACA and DACB registers for each device. Figure 5-1 to Figure 5-3 show the write command for each device. Refer to Figure 1-1 and SPI Timing Specifications Table for detailed input and output timing specifications for both Mode 0,0 and Mode 1,1 operation.
The write command is initiated by driving the CS pin low, followed by clocking the four Configuration bits and the 12 data bits into the SDI pin on the rising edge of SCK. The CS pin is then raised, causing the data to be latched into the selected DAC's input registers. The MCP4802/4812/4822 devices utilize a doublebuffered latch structure to allow both DACA's and DACB's outputs to be synchronized with the LDAC pin, if desired. By bringing down the LDAC pin to a low state, the contents stored in the DAC's input registers are transferred into the DAC's output registers (VOUT), and both VOUTA and VOUTB are updated at the same time. All writes to the MCP4802/4812/4822 devices are 16-bit words. Any clocks after the first 16th clock will be ignored. The Most Significant four bits are Configuration bits. The remaining 12 bits are data bits. No data can be transferred into the device with CS high. The data transfer will only occur if 16 clocks have been transferred into the device. If the rising edge of CS occurs prior, shifting of data into the input registers will be aborted.
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MCP4802/4812/4822
REGISTER 5-1:
W-x A/B bit 15 W-x -- W-x GA
WRITE COMMAND REGISTER FOR MCP4822 (12-BIT DAC)
W-0 SHDN W-x D11 W-x D10 W-x D9 W-x D8 W-x D7 W-x D6 W-x D5 W-x D4 W-x D3 W-x D2 W-x D1 W-x D0 bit 0
REGISTER 5-2:
W-x A/B bit 15 W-x -- W-x GA
WRITE COMMAND REGISTER FOR MCP4812 (10-BIT DAC)
W-0 SHDN W-x D9 W-x D8 W-x D7 W-x D6 W-x D5 W-x D4 W-x D3 W-x D2 W-x D1 W-x D0 W-x x W-x x bit 0
REGISTER 5-3:
W-x A/B bit 15 Where: bit 15 W-x -- W-x GA
WRITE COMMAND REGISTER FOR MCP4802 (8-BIT DAC)
W-0 SHDN W-x D7 W-x D6 W-x D5 W-x D4 W-x D3 W-x D2 W-x D1 W-x D0 W-x x W-x x W-x x W-x x bit 0
A/B: DACA or DACB Selection bit 1 = Write to DACB 0 = Write to DACA -- Don't Care GA: Output Gain Selection bit 1 = 1x (VOUT = VREF * D/4096) 0 = 2x (VOUT = 2 * VREF * D/4096), where internal VREF = 2.048V.
1= 0=
bit 14 bit 13
bit 12
SHDN: Output Shutdown Control bit Active mode operation. VOUT is available. Shutdown the selected DAC channel. Analog output is not available at the channel that was shut down. VOUT pin is connected to 500 ktypical)
bit 11-0
D11:D0: DAC Input Data bits. Bit x is ignored.
Legend R = Readable bit -n = Value at POR W = Writable bit 1 = bit is set U = Unimplemented bit, read as `0' 0 = bit is cleared x = bit is unknown
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MCP4802/4812/4822
CS 0 SCK config bits SDI A/B 12 data bits 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 (Mode 1,1) (Mode 0,0)
-- GA SHDN D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0
LDAC
VOUT
FIGURE 5-1:
Write Command for MCP4822 (12-bit DAC).
CS 0 SCK config bits SDI A/B 12 data bits X X 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 (Mode 1,1) (Mode 0,0)
-- GA SHDN D9 D8 D7 D6 D5 D4 D3 D2 D1 D0
LDAC
VOUT
Note:
X = "don't care" bits.
FIGURE 5-2:
Write Command for MCP4812 (10-bit DAC).
CS 0 SCK config bits SDI A/B 12 data bits X X X X 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 (Mode 1,1) (Mode 0,0)
-- GA SHDN D7 D6 D5 D4 D3 D2 D1 D0
LDAC
VOUT
Note:
X = "don't care" bits.
FIGURE 5-3:
Write Command for MCP4802 (8-bit DAC).
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MCP4802/4812/4822
6.0 TYPICAL APPLICATIONS
6.3 Output Noise Considerations
The MCP4802/4812/4822 family of devices are general purpose DACs for various applications where a precision operation with low-power and internal voltage reference is required. Applications generally suited for the devices are: * * * * * Set Point or Offset Trimming Sensor Calibration Precision Selectable Voltage Reference Portable Instrumentation (Battery-Powered) Calibration of Optical Communication Devices The voltage noise density (in V/Hz) is illustrated in Figure 2-13. This noise appears at VOUTX, and is primarily a result of the internal reference voltage. Its 1/f corner (fCORNER) is approximately 400 Hz. Figure 2-14 illustrates the voltage noise (in mVRMS or mVP-P). A small bypass capacitor on VOUTX is an effective method to produce a single-pole Low-Pass Filter (LPF) that will reduce this noise. For instance, a bypass capacitor sized to produce a 1 kHz LPF would result in an ENREF of about 100 VRMS. This would be necessary when trying to achieve the low DNL error performance (at G = 1) that the MCP4802/4812/4822 devices are capable of. The tested range for stability is .001F through 4.7 F. VDD C1 = 10 F C2 = 0.1 F VDD C1 C1 VOUTA MCP48x2 1 F C2 VOUTB SDI C2 C1 VDD C2
6.1
Digital Interface
The MCP4802/4812/4822 devices utilize a 3-wire synchronous serial protocol to transfer the DAC's setup and input codes from the digital devices. The serial protocol can be interfaced to SPI or Microwire peripherals that is common on many microcontroller units (MCUs), including Microchip's PIC(R) MCUs and dsPIC(R) DSCs. In addition to the three serial connections (CS, SCK and SDI), the LDAC signal synchronizes the two DAC outputs. By bringing down the LDAC pin to "low", all DAC input codes and settings in the two DAC input registers are latched into their DAC output registers at the same time. Therefore, both DACA and DACB outputs are updated at the same time. Figure 6-1 shows an example of the pin connections. Note that the LDAC pin can be tied low (VSS) to reduce the required connections from 4 to 3 I/O pins. In this case, the DAC output can be immediately updated when a valid 16 clock transmission has been received and the CS pin has been raised.
CS1
VOUTA 1 F VOUTB
MCP48x2
SDI
AVSS
SDO SCK LDAC CS0
6.2
Power Supply Considerations
AVSS VSS
The typical application will require a bypass capacitor in order to filter out the noise in the power supply traces. The noise can be induced onto the power supply's traces from various events such as digital switching or as a result of changes on the DAC's output. The bypass capacitor helps to minimize the effect of these noise sources. Figure 6-1 illustrates an appropriate bypass strategy. In this example, two bypass capacitors are used in parallel: (a) 0.1 F (ceramic) and (b)10 F (tantalum). These capacitors should be placed as close to the device power pin (VDD) as possible (within 4 mm). The power source supplying these devices should be as clean as possible. If the application circuit has separate digital and analog power supplies, VDD and VSS of the device should reside on the analog plane.
FIGURE 6-1: Diagram.
Typical Connection
6.4
Layout Considerations
Inductively-coupled AC transients and digital switching noises can degrade the output signal integrity, and potentially reduce the device performance. Careful board layout will minimize these effects and increase the Signal-to-Noise Ratio (SNR). Bench testing has shown that a multi-layer board utilizing a low-inductance ground plane, isolated inputs and isolated outputs with proper decoupling, is critical for the best performance. Particularly harsh environments may require shielding of critical signals. Breadboards and wire-wrapped boards are not recommended if low noise is desired.
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PIC(R) Microcontroller
MCP4802/4812/4822
6.5 Single-Supply Operation
6.5.1.1 Decreasing Output Step Size
The MCP4802/4812/4822 family of devices are rail-torail voltage output DAC devices designed to operate with a VDD range of 2.7V to 5.5V. Its output amplifier is robust enough to drive small-signal loads directly. Therefore, it does not require any external output buffer for most applications. If the application is calibrating the bias voltage of a diode or transistor, a bias voltage range of 0.8V may be desired with about 200 V resolution per step. Two common methods to achieve a 0.8V range are to either reduce VREF to 0.82V (using the MCP49XX family device that uses external reference) or use a voltage divider on the DAC's output. Using a VREF is an option if the VREF is available with the desired output voltage range. However, occasionally, when using a low-voltage VREF, the noise floor causes SNR error that is intolerable. Using a voltage divider method is another option and provides some advantages when VREF needs to be very low or when the desired output voltage is not available. In this case, a larger value VREF is used while two resistors scale the output range down to the precise desired level. Example 6-1 illustrates this concept. Note that the bypass capacitor on the output of the voltage divider plays a critical function in attenuating the output noise of the DAC and the induced noise from the environment.
6.5.1
DC SET POINT OR CALIBRATION
A common application for the devices is a digitallycontrolled set point and/or calibration of variable parameters, such as sensor offset or slope. For example, the MCP4822 provides 4096 output steps. If G = 1 is selected, the internal 2.048V VREF would produce 500 V of resolution. If G = 2 is selected, the internal 2.048 VREF would produce 1 mV of resolution.
EXAMPLE 6-1:
EXAMPLE CIRCUIT OF SET POINT OR THRESHOLD CALIBRATION
VDD
(a) Single Output DAC: MCP4801 MCP4811 MCP4821 (b) Dual Output DAC: MCP4802 MCP4812 MCP4822
VDD R1
RSENSE
VCC+
DAC
VOUT
VTRIP 0.1 F
Comparator
R2 SPI 3-wire Dn VOUT = 2.048 G -----N 2 R2 V trip = VOUT -------------------- R 1 + R 2
G Dn = = = = N =
VCC-
Gain selection (1x or 2x) Digital value of DAC (0-255) for MCP4801/MCP4802 Digital value of DAC (0-1023) for MCP4811/MCP4812 Digital value of DAC (0-4095) for MCP4821/MCP4822 DAC bit resolution
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MCP4802/4812/4822
6.5.1.2 Building a "Window" DAC
When calibrating a set point or threshold of a sensor, typically only a small portion of the DAC output range is utilized. If the LSb size is adequate enough to meet the application's accuracy needs, the unused range is sacrificed without consequences. If greater accuracy is needed, then the output range will need to be reduced to increase the resolution around the desired threshold. If the threshold is not near VREF, 2VREF or VSS, then creating a "window" around the threshold has several advantages. One simple method to create this "window" is to use a voltage divider network with a pullup and pull-down resistor. Example 6-2 shows this concept.
EXAMPLE 6-2:
SINGLE-SUPPLY "WINDOW" DAC
(a) Single Output DAC: MCP4801 MCP4811 MCP4821 (b) Dual Output DAC: MCP4802 MCP4812 MCP4822
VCC+ VDD VOUT R1 R3
RSENSE
VCC+
Comparator VTRIP 0.1 F VCCVCC-
DAC
SPI 3-wire Dn VOUT = 2.048 G -----N 2
G Dn = = = = N = Gain selection (1x or 2x)
R2
Digital value of DAC (0-255) for MCP4801/MCP4802 Digital value of DAC (0-1023) for MCP4811/MCP4812 Digital value of DAC (0-4095) for MCP4821/MCP4822 DAC bit resolution
Thevenin Equivalent
R2 R3 R 23 = -----------------R2 + R3 V CC+ R 2 + V CC- R 3 V 23 = -----------------------------------------------------R2 + R3 V OUT R23 + V 23 R1 V trip = -------------------------------------------R 1 + R23
VOUT
R1 VO R23 V23
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MCP4802/4812/4822
6.6 Bipolar Operation
Bipolar operation is achievable using the MCP4802/4812/4822 family of devices by utilizing an external operational amplifier (op amp). This configuration is desirable due to the wide variety and availability of op amps. This allows a general purpose DAC, with its cost and availability advantages, to meet almost any desired output voltage range, power and noise performance. Example 6-3 illustrates a simple bipolar voltage source configuration. R1 and R2 allow the gain to be selected, while R3 and R4 shift the DAC's output to a selected offset. Note that R4 can be tied to VDD, instead of VSS, if a higher offset is desired. Also note that a pull-up to VDD could be used instead of R4, or in addition to R4, if a higher offset is desired.
EXAMPLE 6-3:
DIGITALLY-CONTROLLED BIPOLAR VOLTAGE SOURCE
R2 VDD VDD VOUT R3 VIN+ R4 3-wire 0.1 F VCC- R1 VCC+ VO
(a) Single Output DAC: MCP4801 MCP4811 MCP4821 (b) Dual Output DAC: MCP4802 MCP4812 MCP4822
DAC
SPI
Dn VOUT = 2.048 G -----N 2 VOUT R 4 VIN+ = ------------------R 3 + R4 R2 R2 V O = V IN+ 1 + ----- - V DD ----- R 1 R1
G Dn
= = = =
Gain selection (1x or 2x) Digital value of DAC (0-255) for MCP4801/MCP4802 Digital value of DAC (0-1023) for MCP4811/MCP4812 Digital value of DAC (0-4095) for MCP4821/MCP4822 DAC bit resolution
N
=
6.6.1
DESIGN EXAMPLE: DESIGN A BIPOLAR DAC USING EXAMPLE 6-3 WITH 12-BIT MCP4822 OR MCP4821
The equation can be simplified to: - R2 - 2.05 -------- = ---------------R1 4.096V R2 1 ----- = -R1 2
An output step magnitude of 1 mV, with an output range of 2.05V, is desired for a particular application. Step 1: Calculate the range: +2.05V - (-2.05V) = 4.1V. Step 2: Calculate the resolution needed: 4.1V/1 mV = 4100 Since 212 = 4096, 12-bit resolution is desired. Step 3:The amplifier gain (R2/R1), multiplied by fullscale VOUT (4.096V), must be equal to the desired minimum output to achieve bipolar operation. Since any gain can be realized by choosing resistor values (R1+R2), the VREF value must be selected first. If a VREF of 4.096V is used (G=2), solve for the amplifier's gain by setting the DAC to 0, knowing that the output needs to be -2.05V.
If R1 = 20 k and R2 = 10 k, the gain will be 0.5. Step 4: Next, solve for R3 and R4 by setting the DAC to 4096, knowing that the output needs to be +2.05V. R4 2 2.05V + 0.5 4.096V ----------------------- = ------------------------------------------------------- = - R3 + R4 1.5 4.096V 3 If R4 = 20 k, then R3 = 10 k
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MCP4802/4812/4822
6.7 Selectable Gain and Offset Bipolar Voltage Output Using a Dual Output DAC
This circuit is typically used for linearizing a sensor whose slope and offset varies. The equation to design a bipolar "window" DAC would be utilized if R3, R4 and R5 are populated.
In some applications, precision digital control of the output range is desirable. Example 6-4 illustrates how to use the MCP4802/4812/4822 family of devices to achieve this in a bipolar or single-supply application.
EXAMPLE 6-4:
BIPOLAR VOLTAGE SOURCE WITH SELECTABLE GAIN AND OFFSET
R2 VDD VOUTA R1 VCC+ R5 VIN+
VCC+
Dual Output DAC: MCP4802 MCP4812 MCP4822
DACA VDD
(DACA for Gain Adjust) R3
VO
DACB SPI 3 Dn V OUTA = 2.048 G A -----N 2 Dn VOUTB = 2.048 G B -----N 2 VIN+ VOUTB R 4 + V CC- R 3 = -----------------------------------------------R 3 + R4
VOUTB
(DACB for Offset Adjust) R4 VCC-
G N DA , DB = = = = = Gain selection (1x or 2x) DAC bit resolution Digital value of DAC (0-255) for MCP4802 Digital value of DAC (0-1023) for MCP4812 Digital value of DAC (0-4095) for MCP4822
0.1 F
VCC-
R2 R2 V O = V IN+ 1 + ----- - V OUTA ----- - R 1 R1 Offset Adjust Gain Adjust Bipolar "Window" DAC using R4 and R5 Thevenin Equivalent VCC+ R4 + V CC- R 5 V45 = -------------------------------------------R4 + R 5 V OUTB R 45 + V45 R 3 V IN+ = ----------------------------------------------R 3 + R 45 R4R5 R45 = -----------------R4 + R5 R2 R2 V O = V IN+ 1 + ----- - V OUTA ----- R 1 R 1 Offset Adjust Gain Adjust
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MCP4802/4812/4822
6.8 Designing a Double-Precision DAC Using a Dual DAC
Step 1: Calculate the resolution needed: 4.1V/1 V = 4.1 x 106. Since 222 = 4.2 x 106, 22-bit resolution is desired. Since DNL = 0.75 LSb, this design can be done with the 12-bit MCP4822 DAC. Step 2: Since DACB's VOUTB has a resolution of 1 mV, its output only needs to be "pulled" 1/1000 to meet the 1 V target. Dividing VOUTA by 1000 would allow the application to compensate for DACB's DNL error. Step 3: If R2 is 100, then R1 needs to be 100 k. Step 4: The resulting transfer function is shown in the equation of Example 6-5.
Example 6-5 illustrates how to design a single-supply voltage output capable of up to 24-bit resolution from a dual 12-bit DAC (MCP4822). This design is simply a voltage divider with a buffered output. As an example, if an application similar to the one developed in Section 6.6.1 "Design Example: Design a Bipolar DAC Using Example 6-3 with 12bit MCP4822 or MCP4821" required a resolution of 1 V instead of 1 mV, and a range of 0V to 4.1V, then 12-bit resolution would not be adequate.
EXAMPLE 6-5:
VDD
SIMPLE, DOUBLE-PRECISION DAC WITH MCP4822
MCP4822
VOUTA (DACA for Fine Adjustment) R1 >> R2 R1
VCC+ VO
VDD VOUTB (DACB for Course Adjustment) SPI 3-wire DA VOUTA = 2.048 G A ------12 2 DB V OUTB = 2.048 GB ------12 2 V OUTA R 2 + VOUTB R 1 VO = ----------------------------------------------------R 1 + R2 R2 0.1 F VCC-
MCP4822
Gx Dn
= =
Gain selection (1x or 2x) Digital value of DAC (0-4096)
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MCP4802/4812/4822
6.9 Building Programmable Current Source
However, this also reduces the resolution that the current can be controlled with. The voltage divider, or "window", DAC configuration would allow the range to be reduced, thus increasing resolution around the range of interest. When working with very small sensor voltages, plan on eliminating the amplifier's offset error by storing the DAC's setting under known sensor conditions.
Example 6-6 shows an example of building a programmable current source using a voltage follower. The current sensor (sensor resistor) is used to convert the DAC voltage output into a digitally-selectable current source. Adding the resistor network from Example 6-2 would be advantageous in this application. The smaller RSENSE is, the less power dissipated across it.
EXAMPLE 6-6:
DIGITALLY-CONTROLLED CURRENT SOURCE
VDD or VREF
(a) Single Output DAC: MCP4801 MCP4811 MCP4821 (b) Dual Output DAC: MCP4802 MCP4812 MCP4822
VDD VOUT VCC+
Load IL Ib
DAC
SPI 3-wire
VCC-
RSENSE
IL I b = ----
G Dn
= = = =
Gain selection (1x or 2x) Digital value of DAC (0-255) for MCP4801/MCP4802 Digital value of DAC (0-1023) for MCP4811/MCP4812 Digital value of DAC (0-4095) for MCP4821/MCP4822 DAC bit resolution
V OUT I L = -------------- -----------R sense + 1 where Common-Emitter Current Gain
N
=
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7.0
7.1
DEVELOPMENT SUPPORT
Evaluation and Demonstration Boards
The Mixed Signal PICtailTM Demo Board supports the MCP4802/4812/4822 family of devices. Refer to www.microchip.com for further information on this product's capabilities and availability.
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8.0
8.1
PACKAGING INFORMATION
Package Marking Information
8-Lead MSOP XXXXXX YWWNNN Example: 4822E 009256
8-Lead PDIP (300 mil) XXXXXXXX XXXXXNNN YYWW
Example: MCP4802 E/P e3 256 ^ 1009
8-Lead SOIC (150 mil) XXXXXXXX XXXXYYWW NNN
Example: MCP4812E e3 SN^^ 1009 256
Legend: XX...X Y YY WW NNN
e3
* Note:
Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week `01') Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package.
In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information.
2010 Microchip Technology Inc.
DS22249A-page 35
MCP4802/4812/4822
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DS22249A-page 36
2010 Microchip Technology Inc.
MCP4802/4812/4822
Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging
2010 Microchip Technology Inc.
DS22249A-page 37
MCP4802/4812/4822
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2010 Microchip Technology Inc.
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2010 Microchip Technology Inc.
DS22249A-page 39
MCP4802/4812/4822
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DS22249A-page 40
2010 Microchip Technology Inc.
MCP4802/4812/4822
APPENDIX A: REVISION HISTORY
Revision A (April 2010)
* Original Release of this Document.
2010 Microchip Technology Inc.
DS22249A-page 41
MCP4802/4812/4822
NOTES:
DS22249A-page 42
2010 Microchip Technology Inc.
MCP4802/4812/4822
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. Device X Temperature Range
MCP4802: MCP4802T: MCP4812: MCP4812T: MCP4822: MCP4822T:
/XX Package
Examples:
a) b) Extended temperature, MSOP package. MCP4802T-E/MS: Extended temperature, MSOP package, Tape and Reel. MCP4802-E/P: Extended temperature, PDIP package. MCP4802-E/SN: Extended temperature, SOIC package. MCP4802T-E/SN: Extended temperature, SOIC package, Tape and Reel. Extended temperature, MSOP package. MCP4812T-E/MS: Extended temperature, MSOP package, Tape and Reel. MCP4812-E/P: Extended temperature, PDIP package. MCP4812-E/SN: Extended temperature, SOIC package. MCP4812T-E/SN: Extended temperature, SOIC package, Tape and Reel. Extended temperature, MSOP package. MCP4822T-E/MS: Extended temperature, MSOP package, Tape and Reel. MCP4822-E/P: Extended temperature, PDIP package. MCP4822-E/SN: Extended temperature, SOIC package. MCP4822T-E/SN: Extended temperature, SOIC package, Tape and Reel. MCP4822-E/MS: MCP4812-E/MS: MCP4802-E/MS:
Device:
Dual 8-Bit Voltage Output DAC Dual 8-Bit Voltage Output DAC (Tape and Reel, MSOP and SOIC only) Dual 10-Bit Voltage Output DAC Dual 10-Bit Voltage Output DAC (Tape and Reel, MSOP and SOIC only) Dual 12-Bit Voltage Output DAC Dual 12-Bit Voltage Output DAC (Tape and Reel, MSOP and SOIC only) (Extended)
c) d) e)
a) b) c)
Temperature Range: Package:
E
= -40C to +125C
MS P SN
= = =
8-Lead Plastic Micro Small Outline (MSOP) 8-Lead Plastic Dual In-Line (PDIP) 8-Lead Plastic Small Outline - Narrow, 150 mil (SOIC)
d) e)
a) b) c) d) e)
2010 Microchip Technology Inc.
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MCP4802/4812/4822
NOTES:
DS22249A-page 44
2010 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices: * * * Microchip products meet the specification contained in their particular Microchip Data Sheet. Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. Microchip is willing to work with the customer who is concerned about the integrity of their code. Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable."
* *
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights.
Trademarks The Microchip name and logo, the Microchip logo, dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC32 logo, rfPIC and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MXDEV, MXLAB, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Octopus, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, Total Endurance, TSHARC, UniWinDriver, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. (c) 2010, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. ISBN: 978-1-60932-128-4
Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company's quality system processes and procedures are for its PIC(R) MCUs and dsPIC(R) DSCs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001:2000 certified.
2010 Microchip Technology Inc.
DS22249A-page 45
WORLDWIDE SALES AND SERVICE
AMERICAS
Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://support.microchip.com Web Address: www.microchip.com Atlanta Duluth, GA Tel: 678-957-9614 Fax: 678-957-1455 Boston Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 Chicago Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 Cleveland Independence, OH Tel: 216-447-0464 Fax: 216-447-0643 Dallas Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 Detroit Farmington Hills, MI Tel: 248-538-2250 Fax: 248-538-2260 Kokomo Kokomo, IN Tel: 765-864-8360 Fax: 765-864-8387 Los Angeles Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 Santa Clara Santa Clara, CA Tel: 408-961-6444 Fax: 408-961-6445 Toronto Mississauga, Ontario, Canada Tel: 905-673-0699 Fax: 905-673-6509
ASIA/PACIFIC
Asia Pacific Office Suites 3707-14, 37th Floor Tower 6, The Gateway Harbour City, Kowloon Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431 Australia - Sydney Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 China - Beijing Tel: 86-10-8528-2100 Fax: 86-10-8528-2104 China - Chengdu Tel: 86-28-8665-5511 Fax: 86-28-8665-7889 China - Chongqing Tel: 86-23-8980-9588 Fax: 86-23-8980-9500 China - Hong Kong SAR Tel: 852-2401-1200 Fax: 852-2401-3431 China - Nanjing Tel: 86-25-8473-2460 Fax: 86-25-8473-2470 China - Qingdao Tel: 86-532-8502-7355 Fax: 86-532-8502-7205 China - Shanghai Tel: 86-21-5407-5533 Fax: 86-21-5407-5066 China - Shenyang Tel: 86-24-2334-2829 Fax: 86-24-2334-2393 China - Shenzhen Tel: 86-755-8203-2660 Fax: 86-755-8203-1760 China - Wuhan Tel: 86-27-5980-5300 Fax: 86-27-5980-5118 China - Xian Tel: 86-29-8833-7252 Fax: 86-29-8833-7256 China - Xiamen Tel: 86-592-2388138 Fax: 86-592-2388130 China - Zhuhai Tel: 86-756-3210040 Fax: 86-756-3210049
ASIA/PACIFIC
India - Bangalore Tel: 91-80-3090-4444 Fax: 91-80-3090-4123 India - New Delhi Tel: 91-11-4160-8631 Fax: 91-11-4160-8632 India - Pune Tel: 91-20-2566-1512 Fax: 91-20-2566-1513 Japan - Yokohama Tel: 81-45-471- 6166 Fax: 81-45-471-6122 Korea - Daegu Tel: 82-53-744-4301 Fax: 82-53-744-4302 Korea - Seoul Tel: 82-2-554-7200 Fax: 82-2-558-5932 or 82-2-558-5934 Malaysia - Kuala Lumpur Tel: 60-3-6201-9857 Fax: 60-3-6201-9859 Malaysia - Penang Tel: 60-4-227-8870 Fax: 60-4-227-4068 Philippines - Manila Tel: 63-2-634-9065 Fax: 63-2-634-9069 Singapore Tel: 65-6334-8870 Fax: 65-6334-8850 Taiwan - Hsin Chu Tel: 886-3-6578-300 Fax: 886-3-6578-370 Taiwan - Kaohsiung Tel: 886-7-536-4818 Fax: 886-7-536-4803 Taiwan - Taipei Tel: 886-2-2500-6610 Fax: 886-2-2508-0102 Thailand - Bangkok Tel: 66-2-694-1351 Fax: 66-2-694-1350
EUROPE
Austria - Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 France - Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Germany - Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 Spain - Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 UK - Wokingham Tel: 44-118-921-5869 Fax: 44-118-921-5820
01/05/10
DS22249A-page 46
2010 Microchip Technology Inc.


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